Based on positive initial collaboration, a Korean semiconductor company reordered 40 heaters for wafer processing. These feature an oxygen-free copper导热layer and ceramic insulation for ±1℃ precision. Laser welding replaced traditional methods to prevent heating inconsistencies. Testing included thermal cycling simulations of 100,000 cycles. Packaging used antistatic bags and vacuum sealing for cleanroom transport. Customers reported 99.5% heating consistency, reducing defects, and plan joint R&D. This order marks entry into high-precision manufacturing, validating our technical capabilities
